Willow + Reed Nail Polish Orchid Plump
Butyl Acetate, Ethyl Acetate, Nitrocellulose, Acetyl Tributyl Citrate, Isopropyl Alcohol, Stearalkonium, Bentonite, Sodium Acrylates Copolymer, Polybutylene Terephthalate, Mica, CI 77891, CI 15850, CI19140, CI 45430, CI 77007.
The original price refers to the full retail price of the product immediately prior to the product being first reduced to clear and may not have applied immediately prior to this sale. An interim price reduction may have occurred.
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